Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire
Broadcom has partnered with South Korea's FuriosaAI to develop AI accelerators using its advanced chip packaging technology. The collaboration aims to create a multi-die system-on-package designed for high-volume AI inference workloads. FuriosaAI's new chips will utilize Broadcom's packaging tech alongside its own memory products to enhance performance and efficiency.
- ▪Broadcom is collaborating with FuriosaAI to build AI accelerators on its chip packaging technology.
- ▪The new chips will be manufactured using a 2nm process and will incorporate advanced memory solutions.
- ▪FuriosaAI's previous generation chips offered competitive performance while consuming significantly less power than rivals.
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