Huawei claims it will make cutting-edge semiconductors by 2031
Huawei has announced plans to manufacture advanced semiconductor chips by 2031, claiming they will match the competition's capabilities. The company aims to produce chips with a transistor density comparable to the 1.4-nanometer processes used by industry leaders. This development comes amid ongoing US trade sanctions that have limited Huawei's access to essential manufacturing equipment.
- ▪Huawei claims it will produce cutting-edge semiconductor chips by 2031.
- ▪The company aims to match the 1.4-nanometer processes of competitors like TSMC and Samsung.
- ▪Huawei's chips are expected to be more cost-effective despite being five years behind the competition.
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News Computing Huawei claims it will make cutting-edge semiconductors by 2031 The company said its next-gen chips will be “feasible and affordable.” By Jackson Chen May 25, 2026 12:51 pm EST Wongsakorn 2468/Shutterstock Huawei has made a bold claim that it can manufacture its own semiconductor chips that are just as good as the competition thanks to a new breakthrough. At a semiconductor symposium in Shanghai, the Chinese company said it will be able to produce chips with transistor density that can match the 1.4-nanometer processes that competitors are expected to use, like Taiwan Semiconductor Manufacturing Corp (TSMC), Samsung and others.
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