Huawei now says it can build 1.4nm-class chips without ASML's most advanced machines
Huawei Technologies announced it is developing a method to produce chips with transistor densities comparable to a 1.4‑nanometer process without using ASML’s extreme ultraviolet lithography machines. The approach relies on stacking multiple circuit layers and a design framework called LogicFolding, which will be used in upcoming Kirin smartphone chips. Industry analysts view the effort as a notable but unproven alternative to traditional chip manufacturing amid ongoing US export restrictions.
- ▪Huawei says its new architecture can achieve 1.4nm‑class density by 2031 using stacked layers and advanced packaging.
- ▪The company has been blocked from accessing ASML equipment due to US export controls and has spent six years refining its semiconductor capabilities.
- ▪Huawei has already mass‑produced 381 chip models using related techniques, but independent performance data against rivals is not yet available.
- ▪Analysts note challenges such as heat management and increased design complexity that must be resolved before large‑scale deployment.
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Hardware Industry chip huawei Huawei says it can build 1.4nm chips without ASML's most advanced machines Cut off from advanced lithography tools, Huawei is betting on stacked chip architectures and new packaging methods By Skye Jacobs May 25, 2026, 7:49 10 comments Serving tech enthusiasts for over 25 years. TechSpot means tech analysis and advice you can trust. What we know so far: Huawei Technologies is betting it can sidestep one of the semiconductor industry's most entrenched dependencies: the need for cutting-edge lithography machines. The company says it has developed a way to build advanced chips without access to the specialized equipment that has long defined the global pecking order in chipmaking.
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