Intel and 3DGS to establish $3.3B substrate plant in India
Intel and 3DGS are investing $3.3 billion to establish a substrate manufacturing plant in Odisha, India. This facility will focus on advanced packaging technologies essential for the global chip supply chain. The project aims to create over 1,800 high-skilled jobs and is part of India's broader semiconductor initiative.
- ▪The new plant will specialize in glass core substrates and high-density interconnect substrates.
- ▪The project is expected to take five to six years to complete.
- ▪A memorandum of understanding has been signed between the Odisha government, Intel, and 3DGS.
Opening excerpt (first ~120 words) tap to expand
Intel and 3DGS to establish $3.3B substrate plant in India The chipmaking giant partners with 3DGS to build an advanced packaging facility in Odisha, marking a major step in India's semiconductor ambitions. Share Add us on Google by Editorial Team May. 29, 2026 window.sevioads = window.sevioads || []; var sevioads_preferences = []; sevioads_preferences[0] = {}; sevioads_preferences[0].zone = "01f21ccf-2092-46b1-9ac7-8c44cc782e0f"; sevioads_preferences[0].adType = "native"; sevioads_preferences[0].inventoryId = "c5700508-581b-472c-8fdd-a931cdbfc8e1"; sevioads_preferences[0].accountId = "1e47efc1-ec2d-4fca-a8b9-354e249e5095"; sevioads.push(sevioads_preferences); Intel and 3DGS Inc. are pouring $3.3 billion into a new substrate manufacturing plant in India’s Odisha state.
…
Excerpt limited to ~120 words for fair-use compliance. The full article is at Crypto Briefing.
Discussion
0 commentsMore from Crypto Briefing
