MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
MediaTek is diversifying its chip packaging strategy by adopting Intel's EMIB technology alongside TSMC's services. This decision comes as TSMC's capacity is strained due to high demand for AI chips. By utilizing multiple packaging options, MediaTek aims to mitigate risks associated with relying solely on TSMC.
- ▪MediaTek is now using Intel's EMIB packaging technology alongside TSMC's CoWoS and SoIC services.
- ▪The move is a response to TSMC's advanced packaging capacity being stretched thin.
- ▪MediaTek aims to capture roughly 26% of the AI ASIC market by 2028.
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MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity. Share Add us on Google by Editorial Team May. 29, 2026 window.sevioads = window.sevioads || []; var sevioads_preferences = []; sevioads_preferences[0] = {}; sevioads_preferences[0].zone = "01f21ccf-2092-46b1-9ac7-8c44cc782e0f"; sevioads_preferences[0].adType = "native"; sevioads_preferences[0].inventoryId = "c5700508-581b-472c-8fdd-a931cdbfc8e1"; sevioads_preferences[0].accountId = "1e47efc1-ec2d-4fca-a8b9-354e249e5095"; sevioads.push(sevioads_preferences); MediaTek is no longer putting all its silicon eggs in one basket.
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