Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies
This is essentially next-generation 3D NAND technology that is used today by almost everyone, including Kioxia/Sandisk, SK Hynix, and YMTC (which was the first company to adopt such a method). Disclaimer This article is a preview of the type of content that readers can expect from our subscription service, Tom's Hardware Premium. Tom's Hardware Premium Subcription: $29 at tomshardware.comDon’t miss out on this Tom’s Hardware Premium.
- ▪This is essentially next-generation 3D NAND technology that is used today by almost everyone, including Kioxia/Sandisk, SK Hynix, and YMTC (which was the first company to adopt such a method).
- ▪Disclaimer This article is a preview of the type of content that readers can expect from our subscription service, Tom's Hardware Premium.
- ▪Tom's Hardware Premium Subcription: $29 at tomshardware.comDon’t miss out on this Tom’s Hardware Premium.
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| Original publisher | Tom's Hardware |
| Canonical URL | https://www.tomshardware.com/pc-components/dram/samsung-debuts-three-next-generation-memory-technologies-for-ai-data-centers-zhbm-znand-o-and-bv-nand-all-rely-on-advanced-wafer-bonding-technologies |
| Publication time | Thu, 06 Aug 2026 13:11:09 +0000 |
| Retrieval time | 2026-08-06T13:15:42.699Z |
| Last seen | 2026-08-06T13:15:42.699Z |
| Headline source | Publisher (no WeSearch rewrite) |
| Excerpt source | publisher body |
| Excerpt method | First ~120 words (~800 chars) of extracted publisher body, fair-use limited. |
| Summary | WeSearch · cerebras-chat (WeSearch summarizer) |
| Summary source text | contentText |
| Citation coverage | Summary is a WeSearch-generated derivative; primary citation is the original publisher URL. |
| Cluster | YviruugKbhL_ · 1 stories |
| Cluster logic | Grouped by semantic title/content similarity across sources within a rolling window. Same-publisher template collisions are excluded from coverage comparison. |
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| Publisher visit | Yes — open original |
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| Indexing | May the item be indexed (stored, ranked, made findable)? | Allowed |
| Snippet | May a short excerpt of the publisher's text be shown? | Allowed |
| AI summary | May WeSearch generate its own short summary of the article? | Limited |
| Retrieval / RAG | May the content be exposed for third-party retrieval-augmented generation? | Not asserted |
| Model training | May the content be used to train AI models? | Not asserted |
| Commercial reuse | May the content be reused commercially? | Not permitted |
Basis: Derived from the published RSS/Atom feed. Contact: [email protected]. Reviewed: 2026-07-24.
Opening excerpt (first ~120 words) tap to expand
PC Components RAM DRAM Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies News-analysis By Anton Shilov Published 6 August 2026 Next generation wafer bonding enables innovative types of memory When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: Samsung) Share Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter This week, Samsung presented its vision for next-generation memory and storage solutions both for AI and general-purpose applications at the Future of Memory and Storage (FMS)…
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