Samsung has reportedly developed 900-layer flash memory chips and I'm thinking SSDs could get seriously cheap if this AI bubble ever pops
Samsung has developed a prototype NAND memory chip with 900 layers, achieved by stacking two 450-layer wafers. This advancement could significantly increase memory capacity while maintaining the same physical dimensions. The implications for cost and market demand, particularly in the AI industry, remain to be seen.
- ▪Samsung's new 900-layer memory chip utilizes Cell Multi-Bonding technology.
- ▪The current highest layer count for NAND flash memory is SK Hynix's 321-layer technology.
- ▪The new chip design addresses challenges such as precise alignment and warping during manufacturing.
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Hardware Storage SSDs Samsung has reportedly developed 900-layer flash memory chips and I'm thinking SSDs could get seriously cheap if this AI bubble ever pops News By Jeremy Laird published 26 May 2026 Two 450-layer memory chips bonded together. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: Samsung) Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Samsung has developed a new prototype NAND memory chip composed of an incredible 900 layers, according to a new report.
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