Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung to Double HBM4 Output Next Year, Sources SayHBM capacity to expand to 250,000 wafers a month Glass carrier, essential for high-layer stacking, in focus Outsourced glass carrier volume to rise 2.5-fold Sixth- and seventh-generation chips to make up 80% of outputFinance|Published 2026.09.20. Yonhap NewsSamsung Electronics (005930) is expected to more than double output of its HBM4 family of high-bandwidth memory chips next year, including sixth-generation HBM4 and seventh-generation HBM4E, as the company plans to raise demand for glass carriers by 2.5 times from this year. Glass carrier requirements stood at 10,000 sheets a month as recently as last year, doubling this year and set to rise 2.5-fold next year.A glass carrier is a support temporarily attached to the underside of an HBM DRAM wafer to prevent bending or cracking while the wafer is ground thin and drilled.
- ▪Samsung to Double HBM4 Output Next Year, Sources SayHBM capacity to expand to 250,000 wafers a month Glass carrier, essential for high-layer stacking, in focus Outsourced glass carrier volume to rise 2.5-fold Sixth- and seventh-generation c
- ▪Yonhap NewsSamsung Electronics (005930) is expected to more than double output of its HBM4 family of high-bandwidth memory chips next year, including sixth-generation HBM4 and seventh-generation HBM4E, as the company plans to raise demand f
- ▪Glass carrier requirements stood at 10,000 sheets a month as recently as last year, doubling this year and set to rise 2.5-fold next year.A glass carrier is a support temporarily attached to the underside of an HBM DRAM wafer to prevent ben
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| Original publisher | Seoul Economic Daily |
| Canonical URL | https://en.sedaily.com/finance/2026/09/20/samsung-to-double-hbm4-output-next-year-sources-say |
| Publication time | Sun, 20 Sep 2026 17:38:50 +0000 |
| Retrieval time | 2026-09-20T18:13:46.875Z |
| Last seen | 2026-09-20T18:13:46.875Z |
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Samsung to Double HBM4 Output Next Year, Sources SayHBM capacity to expand to 250,000 wafers a month Glass carrier, essential for high-layer stacking, in focus Outsourced glass carrier volume to rise 2.5-fold Sixth- and seventh-generation chips to make up 80% of outputFinance|Published 2026.09.20. 16:33:51| Updated 2026.09.20. 23:30:08|By Seo [email protected]|Summary|SaveAAAA shareholder photographs sixth-generation high-bandwidth memory (HBM4) and seventh-generation HBM4E chips with a smartphone camera at Samsung Electronics' 57th annual general meeting of shareholders, held in March at the Suwon Convention Center in Yeongtong-gu, Suwon, Gyeonggi Province.
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