SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis
The ZEISS Crossbeam 750 is designed for precision in FIB-SEM workflows, particularly for semiconductor failure analysis. It features advanced technology that enhances image quality and reduces acquisition times, making it suitable for challenging lamella preparation. This tool aims to improve efficiency and outcomes for professionals in the semiconductor industry.
- ▪The Crossbeam 750 includes a new Gemini 4 SEM objective lens and a double deflector for enhanced imaging.
- ▪It allows for immediate visual feedback during FIB milling, improving process confidence.
- ▪The system is tailored for semiconductor failure analysts and materials scientists seeking faster results.
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| Original publisher | Bizzabo |
| Canonical URL | https://events.bizzabo.com/868497/home |
| Publication time | Thu, 21 May 2026 10:00:02 +0000 |
| Retrieval time | 2026-05-21T10:01:10.462Z |
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Join us to discover how the new ZEISS Crossbeam 750 with its see while you mill capability delivers precision and clarity—every time—for demanding FIB-SEM workflows. Designed for extremely challenging TEM lamella preparation, tomography, advanced nanofabrication, and APT‑ready lift‑out, Crossbeam 750 combines a new Gemini 4 SEM objective lens, a double deflector, and a next‑generation scan generator to elevate both image quality and process confidence. You’ll learn how better resolution and better SNR translate into more image detail and shorter acquisition times, while the low‑kV FIB performance enables more precise lamella prep. We’ll demonstrate High Dynamic Range (HDR) Mill + SEM—an interwoven SEM/FIB scanning mode that suppresses FIB‑generated background.
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Excerpt limited to ~120 words for fair-use compliance. The full article is at Bizzabo.
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