The Galaxy S27’s chip could be much cooler thanks to this fundamental change
The upcoming Samsung Exynos 2700 chip for the Galaxy S27 series will place the processor and DRAM side-by-side on the same substrate, a shift from previous stacked designs. This change is expected to improve thermal performance, enabling better sustained performance and lower operating temperatures. It follows Samsung's use of a Heat Path Block in the Exynos 2600 and may allow more efficient cooling for high-clock-speed Arm CPU cores. The design could benefit demanding tasks like gaming and high-resolution video recording.
- ▪The Samsung Exynos 2700 will feature a side-by-side layout of the processor and DRAM on the same substrate.
- ▪This design change is intended to enhance thermal performance compared to previous stacked configurations.
- ▪Improved cooling may support higher sustained performance, especially with Arm’s next CPU core targeting nearly 5GHz speeds.
- ▪The Exynos 2600 used a Heat Path Block as a heat sink, a feature expected to evolve with the new chip layout.
- ▪The Exynos 2700 is planned for use in select Galaxy S27 models, continuing Samsung’s push for better chipset efficiency.
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