Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50%
Intel has detailed improvements in its 18A-P process node, an enhanced version of its 18A (1.8nm-class) technology, highlighting a 9% performance gain or 18% power reduction compared to the base node. The advancements include new gate-all-around RibbonFET transistors, tighter process variability control, and a 50% improvement in thermal conductivity. These enhancements aim to boost performance efficiency and yield, making the node attractive to potential customers like Apple and other fabless chip designers.
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Tech Industry Manufacturing Semiconductors Intel details 18A-P process node, touts higher performance, lower power, and better thermals — 9% more performance, thermal conductivity improved by 50% News By Anton Shilov published 1 May 2026 More mature, more attractive. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: Tom's Hardware) Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Intel is ramping up production of its CPUs on its 18A (1.8nm-class) process technology with promising results, but at the same time, the work on its enhanced version called 18A-P is well underway with…
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