Open architecture multi-beam EBL for sub-10nm sovereign chip manufacturing
The article discusses the release of an open-source design package for a multi-beam direct-write electron-beam lithography machine. This architecture aims to reduce costs for semiconductor manufacturing while avoiding single-vendor dependencies. It includes comprehensive documentation and simulation tools for potential users and developers.
- ▪The multi-beam EBL architecture targets semiconductor manufacturing in the 50–180 nm range at a significantly lower cost than EUV tools.
- ▪The design package is released under open licenses, allowing public access and modification without patent claims.
- ▪It includes detailed specifications, simulations, and a software stack to assist users in building and utilizing the technology.
Opening excerpt (first ~120 words) tap to expand
Multi-Beam Direct-Write Electron Lithography — Open Architecture v5 An open, mask-free, multi-vendor architecture for mature-node semiconductor manufacturing — published, simulated, and software-defined. Release: v5 (May 16, 2026) — final integrated open-source release with full software stack (GDS-II pattern compiler, real-time control firmware, tool operating system) layered on top of the v4.1 hardware engineering. Author: Robert Gerald Morin (NÎKI Nation Builders, Edmonton AB, Canada) ORCID: 0009-0008-8373-1496 Correspondence: [email protected] License: papers under CC BY 4.0 · code under MIT (see LICENSE.papers, LICENSE.code) How to cite Morin, R. G. (2026). Multi-Beam Direct-Write Electron Lithography via Multi-Rate Electromagnetic Steering — v5 Open Architecture Release. Zenodo.
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Excerpt limited to ~120 words for fair-use compliance. The full article is at GitHub.