Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops
Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops Written by Michael Larabel in Hardware on 5 October 2026 at 06:04 AM EDT. Add A Comment A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support. Some Qualcomm SoCs are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon.
- ▪Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops Written by Michael Larabel in Hardware on 5 October 2026 at 06:04 AM EDT.
- ▪Add A Comment A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support.
- ▪Some Qualcomm SoCs are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon.
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| Original publisher | Phoronix |
| Canonical URL | https://www.phoronix.com/news/Qualcomm-HW-BIn-Trip-Point |
| Publication time | Mon, 05 Oct 2026 06:04:53 -0400 |
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Qualcomm Patching Linux For Hardware Thermal Binning To Benefit Snapdragon X Laptops Written by Michael Larabel in Hardware on 5 October 2026 at 06:04 AM EDT. Add A Comment A new patch series sent out from Qualcomm that aims to help at least the Snapdragon X series laptops is hardware-binned trip point support. Some Qualcomm SoCs are available in different multiple thermal/package bins with different junction temperature limits but otherwise being the same silicon. The new Linux patches are working to properly convey that information around the thermal limits for a given piece of silicon. Qualcomm engineer Gaurav Kohli sent out on Friday the Linux thermal subsystem patches working on this hardware-binned trip point support for their SoCs.
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